CA20

The CA20 is Comet Yxlon's 3D X-ray system for advanced semiconductor packaging, from wafer processing to packaged chips. It images micron-sized details — C4 bumps, copper pillars, microbumps, TSVs and substrate-strip bumps — non-destructively within minutes, revealing defects such as non-wet, head-in-pillow, bump shift and voids, and allowing stand-off height to be used to monitor die tilt or warpage.

Two versions are documented: MXI/Lab for R&D and failure analysis, and AXI/Fab, a fully automated solution with loader and automated defect classification (ADC) that integrates into fab material and data flows. Inside the cabinet, Comet Yxlon states cleanroom conditions comparable to ISO Class 3; the Fab version's footprint depends on fan filter unit / cleanroom class.

For wafers, a 2.5D approach captures 2D images at several angles to retain depth information with shorter scan times. Dedicated software includes CoS 3D Clarity acquisition, Dose Manager (with Dose Reduction Kit), Batch Manager and Wafer Manager, and the Dragonfly-based CoS Insights, CoS Insights X 3D and TSV Insights X 2.5D (the X packages require the automatic loader).

Versions & configurations